Thermo-mechanical characterization and integrity checking of packages and movable-structures
نویسندگان
چکیده
The paper presents two methods for measuring the dilatation resulting from thermal expansion. The contact based stylus measurement method and the contact less heterodyne laser interferometry have been compared to prove their effectiveness in measuring small dilatations. The paper presents shortly the application of both methods for measuring thermal expansion, and compares their applicability for thermo-mechanical characterization and integrity checking of packages and movable structures.
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